Materials
Most of a circuit board cost price derives from laminate and prepregs, regarding which, the choice is determined by electrical, thermal, mechanical and environmental properties. This section describes GPV(Su Zhou) standard range of laminates, prepregs and copper foil for multilayer build-ups. Choosing materials within these standard types, the lowest cost price and the shortest delivery time can be achieved.
Material properties
Table 1 shows typical parameters for printed circuit boards built up using GPV(Su Zhou) standard laminates and prepregs.
The FR4 standard and FR4 Hi Tg are UL approved; halogen-free laminates is in the process of being approved, please contact our purchase department for information about the UL approval status of these types.
Multilayer circuit boards are built up using FR4 laminates as core material and prepregs as bonding material between the laminates. Copper foil forms the outer layers. In the following we have listed GPV(Su Zhou) standard range of laminates, prepregs and copper foils. All laminates and prepregs permit multilayer build-ups with a UL 94V0 flammability classification.
FR4 Laminates and prepregs.
Laminates and pregpregs listed in table 2 are tetra functional FR4 laminates/prepregs from Isola.
Glass transition temperature Tg is 140°C by DSC, maximum continuous operating temperature for multilayer boards constructed from these laminates and prepregs is 105°C.
Table 2: Standard FR4 laminates and prepregs
For list with Dk at higher frequences please contact GPV Printed Circuits
|
Type |
Cu Foil 1 (micron) |
Cu Foil 2 (micron) |
Core Thickness (mm) |
Dielectric Constant |
|
FR4 Laminate |
18 |
18 |
0.1 |
4.3 |
|
FR4 Laminate |
35 |
35 |
0.1 |
4.3 |
|
FR4 Laminate |
18 |
18 |
0.15 |
4.1 |
|
FR4 Laminate |
35 |
35 |
0.15 |