Design parameters

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PRODUCT FEATURE Normal Special    Cost

optimum



Layers

Minimum 2 0

Maximum 8 14

Board thickness

Minimum 0.8 mm 0.1 mm 1.0 mm

Maximum 3,2 mm 1.6 mm

Inner layer laminate thickness

Minimum 0,15 mm 0.10mm 0,2 mm

Maximum 1,10 mm 1,4 mm 0,71 mm

Prepreg thickness*

NOTE

Type 7628 FR4 0,191 mm     Yes

Type 2113 FR4 0,1mm

Type 2116 FR4 0,11 mm    Yes

Type 1080 FR4 0,071 mm     Yes

NOTE: 2 prepregs as minimum between laminates unless otherwise specified.

N/A: Not Applicable

Copper thickness

12 micron (1/3 oz) - Yes

17,5 micron (1/2 oz) Yes     X

35 micron (1 oz) Yes

70 micron (2 oz) On request only

105 microns (3 oz) On request only



PRODUCT FEATURE Normal Special Cost

Optimum

Minimum lines and spaces

Line/space inner layers 125 micron For Base Cu thickness 100 microns for base copper thicknes ≤ 17,5 micron 150 microns for base copper thickness ≤ 17,5 microns

≤ 17,5 micron 175 microns for base copper thickness = 35 microns

150 microns for base copper thickness 35 microns

Line/space Outer layers

125 micron For Base Cu thickness
100 microns for base copper thicknes ≤ 12 micron

150 microns for base copper thickness ≤ 17,5 microns

≤ 17,5 micron 175 microns for base copper thickness = 35 microns

150 microns for base copper thickness = 35 microns

Minimum annular ring, pad diam. – finished hole diam. (no breakout) - Mecanical drilled

Inner layers 0,42 mm 0,37 mm 0,5 mm

Outer layers 0,35 mm 0,28 mm 0,4 mm

Viaholes minimum ann.ring, pad diam. – finished hole diam.(no breakout)-Mecanical drilled

Inner layers 0,30 mm 0,25 mm

Outer layers 0,24 mm 0,20 mm

Minimum hole diameter after copper plating

Mech. drilled 0,15 mm 0,10 mm 0,40 mm

Holes, tolerance, (diameter D is nominal)

Through plated hole

0,15 ≤ D ≤ 0,5 mm + 0,1 / -D mm

0,5 ≤ D ≤ 2,0 mm ± 0,075 mm ± 0,10 mm

D = 2,0 thru 6,0 mm ± 0,1 mm

NOTE 1

Press fit connector Hole D ≤ 3,0 mm

NOTE 2 ± 0,05 mm

Non plated hole + 0 / - 0.05 mm

D ≤ 6,0 mm ± 0,05 mm on request only

D > 6,0 mm ± 0,1 mm

NOTE 1: ± 0,050 mm on ENIG/ISn Solder Surface

NOTE 2: After copper plating

PRODUCT FEATURE Normal Special Cost

optimum

Hole copper plating, nominal copper thickness

Via hole minimum

Aspect ratio ≤ 4 25 micron

NOTE 1

Aspect ratio > 4 18 micron

NOTE 2

NOTE 1: assumes an average of 6 measurement points, localized down to 18 microns, if required 25

NOTE 2: assumes an average of 6 measurement points, localized down to 12 microns, if required 18

NOTE 3 assumes an average og 6 measurement points, localized down to 13 microns, if required 15

NOTE 4 assumes an average og 6 measurement points, localized down to 10 microns, if required 12

Maximum Aspect Ratio

Laminate thickness/hole 5 6 3

Hole placement

Hole to pattern NOTE 1 ± 0,1 mm   ± 0,08 mm ± 0,13 mm

Non plated holes drilled in routing program to through holes     ± 0,13 mm

± 0,1 mm

NOTE1: Assumes maximum board dimension 300X300 mm

Solder mask to pattern, placement accuracy and minimum bar

Primary mask ± 0,075 mm ± 0,050 mm ± 0,10 mm

Plug mask NOTE1 ± 0,2 mm

Minimum bar width 0,09 mm 0,075 mm 0,10 mm

NOTE: If required holes with D<0,4 mm are plugged, but not completely filled. Placement is relative to hole.

Viaplugging

Core thickness > 0,5 mm    0,80 mm

Screened legend (component annotation) placement accuracy and minimum features

Minimum distance to solder pad 0,2 mm      0,25 mm

Minimum character height 1,2 mm      1,5 mm

Minimum character stroke width 0,2 mm 0,25 mm



PRODUCT FEATURE Normal Special Cost

optimum

Screened carbon polymers for contacts

Minimum bar width 0,3 mm

Minimum spacing carbon to carbon 0,3 mm

Minimum contact area Carbon to copper 0,2 X 0,3 mm

Minimum carbon/copper overlap 0,2 mm

Minimum distance, carbon to conductor 0,5 mm

Minimum distance carbon to solder mask 0,3 mm

Minimum carbon/solder mask overlap 0,3 mm

Carbon thickness 15 - 30 micron

Maximum resistance after climatic test 200 Ohms

Surface treatment

Hot Air Leveling 1-40 microns

Hot Air Leveling(Leadfree) 1-40 microns

Electroless nickel/gold (ENIG) nickel 4 - 8 microns

gold 0,05 - 0,2 microns

Immersion tin (ISn) 1,0 - 1,3 microns

OSP 0,2 - 0,5 microns

Hard gold NOTE1 nickel 4 microns minimum gold 1,27 micron minimum Nickel > 4 microns

Gold > 1.27

microns

NOTE: Minimum distance between hard gold contacts and hole is 1,0 mm for PCB with hot air leveling and 0,7 mm for PCB with electro less nickel/gold or immersion tin

Peel able mask

Position tolerance ± 0,5 mm      0,75 mm

Minimum area 30 mm2

PRODUCT FEATURE	Normal	Special	Cost
PRODUCT FEATURE	Normal	Special	optimum

Layers
Minimum	2	0
Maximum	8	14
Board thickness
Minimum	0.8 mm	0.1 mm	1.0 mm
Maximum	3,2 mm		1.6 mm
Inner layer laminate thickness
Minimum	0,15 mm	0.10mm	0,2 mm
Maximum	1,10 mm	1,4 mm	0,71 mm

Prepreg thickness*

NOTE
Type 7628 FR4	0,191 mm		Yes
Type 2113 FR4	0,1mm
Type 2116 FR4	0,11 mm		Yes
Type 1080 FR4	0,071 mm		Yes
NOTE: 2 prepregs as minimum between laminates unless otherwise specified. N/A: Not Applicable
Copper thickness
12 micron (1/3 oz)	-	Yes
17,5 micron (1/2 oz)	Yes		X
35 micron (1 oz)	Yes
70 micron (2 oz)	On request only
105 microns (3 oz)		On request only

PRODUCT FEATURE	Normal	Special	Cost
PRODUCT FEATURE	Normal	Special	Optimum
Minimum lines and spaces
Line/space inner layers	125 micron For Base Cu thickness	100 microns for base copper thicknes ≤ 17,5 micron	150 microns for base copper thickness ≤ 17,5 microns
	≤ 17,5 micron		175 microns for base copper thickness = 35 microns
	150 microns for base copper thickness 35 microns
Line/space Outer layers	125 micron For Base Cu thickness	100 microns for base copper thicknes ≤ 12 micron	150 microns for base copper thickness ≤ 17,5 microns
	≤ 17,5 micron		175 microns for base copper thickness = 35 microns
	150 microns for base copper thickness = 35 microns
Minimum annular ring, pad diam. – finished hole diam. (no breakout) - Mecanical drilled
Inner layers	0,42 mm	0,37 mm	0,5 mm
Outer layers	0,35 mm	0,28 mm	0,4 mm
Viaholes minimum ann.ring, pad diam. – finished hole diam.(no breakout)-Mecanical drilled
Inner layers	0,30 mm	0,25 mm
Outer layers	0,24 mm	0,20 mm
Minimum hole diameter after copper plating
Mech. drilled	0,15 mm	0,10 mm	0,40 mm
Holes, tolerance, (diameter D is nominal)
Through plated hole
0,15 ≤ D ≤ 0,5 mm	+ 0,1 / -D mm
0,5 ≤ D ≤ 2,0 mm	± 0,075 mm		± 0,10 mm
D = 2,0 thru 6,0 mm	± 0,1 mm
NOTE 1
Press fit connector Hole D ≤ 3,0 mm
NOTE 2	± 0,05 mm
Non plated hole		+ 0 / - 0.05 mm
D ≤ 6,0 mm	± 0,05 mm	on request only
D > 6,0 mm	± 0,1 mm
NOTE 1: ± 0,050 mm on ENIG/ISn Solder Surface
NOTE 2: After copper plating

PRODUCT FEATURE	Normal	Special	Cost
PRODUCT FEATURE	Normal	Special	optimum
Hole copper plating, nominal copper thickness
Via hole minimum
Aspect ratio ≤ 4	25 micron
	NOTE 1
Aspect ratio > 4	18 micron
Aspect ratio > 4	NOTE 2

NOTE 1: assumes an average of 6 measurement points, localized down to 18 microns, if required 25
NOTE 2: assumes an average of 6 measurement points, localized down to 12 microns, if required 18
NOTE 3 assumes an average og 6 measurement points, localized down to 13 microns, if required 15
NOTE 4 assumes an average og 6 measurement points, localized down to 10 microns, if required 12

Maximum Aspect Ratio
Laminate thickness/hole	5	6	3
Hole placement
Hole to pattern NOTE 1	± 0,1 mm	± 0,08 mm	± 0,13 mm
Non plated holes drilled in routing program to through holes			± 0,13 mm
	± 0,1 mm		± 0,13 mm
NOTE1: Assumes maximum board dimension 300X300 mm
Solder mask to pattern, placement accuracy and minimum bar
Primary mask	± 0,075 mm	± 0,050 mm	± 0,10 mm
Plug mask NOTE1	± 0,2 mm
Minimum bar width	0,09 mm	0,075 mm	0,10 mm
NOTE: If required holes with D<0,4 mm are plugged, but not completely filled. Placement is relative to hole.
Viaplugging
Core thickness	> 0,5 mm		0,80 mm
Screened legend (component annotation) placement accuracy and minimum features
Minimum distance to solder pad	0,2 mm		0,25 mm
Minimum character height	1,2 mm		1,5 mm
Minimum character stroke width	0,2 mm		0,25 mm

PRODUCT FEATURE	Normal	Special	Cost
PRODUCT FEATURE	Normal	Special	optimum
Screened carbon polymers for contacts
Minimum bar width	0,3 mm
Minimum spacing carbon to carbon	0,3 mm
Minimum contact area Carbon to copper	0,2 X 0,3 mm
Minimum carbon/copper overlap	0,2 mm
Minimum distance, carbon to conductor	0,5 mm
Minimum distance carbon to solder mask	0,3 mm
Minimum carbon/solder mask overlap	0,3 mm
Carbon thickness	15 - 30 micron
Maximum resistance after climatic test	200 Ohms
Surface treatment
Hot Air Leveling	1-40 microns
Hot Air Leveling(Leadfree)	1-40 microns
Electroless nickel/gold (ENIG)	nickel 4 - 8 microns
Electroless nickel/gold (ENIG)	gold 0,05 - 0,2 microns
Immersion tin (ISn)	1,0 - 1,3 microns
OSP	0,2 - 0,5 microns
Hard gold NOTE1	nickel 4 microns minimum gold 1,27 micron minimum	Nickel > 4 microns
		Gold > 1.27
		microns
NOTE: Minimum distance between hard gold contacts and hole is 1,0 mm for PCB with hot air leveling and 0,7 mm for PCB with electro less nickel/gold or immersion tin
Peel able mask
Position tolerance	± 0,5 mm		0,75 mm
Minimum area	30 mm2