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Design parameters

 

View the Technology Road Map for GPV Printed Circuits here (pdf file format).

 

PRODUCT FEATURE Normal     Special     Cost
optimum
                
Layers
Minimum  2 0     
Maximum 8 14     
Board thickness
Minimum  0.8 mm  0.1 mm 1.0 mm 
Maximum 3,2 mm   1.6 mm 
Inner layer laminate thickness 
Minimum  0,15 mm 0.10mm 0,2 mm 
Maximum  1,10 mm 1,4 mm 0,71 mm 
       
Prepreg thickness*
 
NOTE 
Type 7628 FR4  0,191 mm     Yes
Type 2113 FR4  0,1mm     
Type 2116 FR4  0,11 mm    Yes
Type 1080 FR4  0,071 mm     Yes 

NOTE: 2 prepregs as minimum between laminates unless otherwise specified.

N/A: Not Applicable 

Copper thickness 
12 micron (1/3 oz)  - Yes     
17,5 micron  (1/2 oz)  Yes     X
35 micron (1 oz)  Yes         
70 micron (2 oz)  On request only         
105 microns (3 oz)  On request only
       
PRODUCT FEATURE Normal Special Cost 
Optimum
Minimum lines and spaces   
Line/space inner layers  125 micron For Base Cu thickness 100 microns for base copper thicknes ≤ 17,5 micron  150 microns for base copper thickness ≤ 17,5 microns
≤ 17,5 micron 175 microns for base copper thickness = 35 microns 
150 microns for base copper thickness 35 microns  
Line/space Outer layers 

 

125 micron For Base Cu thickness

 100 microns for base copper thicknes ≤ 12 micron 

 

150 microns for base copper thickness ≤ 17,5 microns

≤ 17,5 micron 175 microns for base copper thickness = 35 microns 
150 microns for base copper thickness = 35 microns  
Minimum annular ring, pad diam. – finished hole diam.  (no breakout) - Mecanical drilled 
Inner layers  0,42 mm 0,37 mm 0,5 mm 
Outer layers  0,35 mm 0,28 mm 0,4 mm 
Viaholes minimum ann.ring, pad diam. – finished hole diam.(no breakout)-Mecanical drilled
Inner layers  0,30 mm 0,25 mm    
Outer layers  0,24 mm 0,20 mm    
Minimum hole diameter after copper plating 
Mech. drilled  0,15 mm 0,10 mm 0,40 mm 
Holes, tolerance, (diameter D is nominal) 
Through plated hole        
0,15 ≤ D ≤ 0,5 mm + 0,1 / -D mm  
0,5 ≤ D ≤ 2,0 mm ± 0,075 mm ± 0,10 mm 
D = 2,0 thru 6,0 mm ± 0,1 mm  
NOTE 1    
Press fit connector Hole D ≤ 3,0 mm        
NOTE 2 ± 0,05 mm   
Non plated hole   + 0 / - 0.05 mm  
D ≤ 6,0 mm ± 0,05 mm on request only   
D > 6,0 mm  ±  0,1 mm    
NOTE 1: ± 0,050 mm on ENIG/ISn Solder Surface
NOTE 2: After copper plating
PRODUCT FEATURE Normal Special Cost 
optimum
Hole copper plating, nominal copper thickness 
Via hole minimum        
Aspect ratio ≤ 4  25 micron   
  NOTE 1   
Aspect ratio > 4  18 micron       
NOTE 2 
 
NOTE 1: assumes an average of 6 measurement points, localized down to 18 microns, if required 25
NOTE 2: assumes an average of 6 measurement points, localized down to 12 microns, if required 18
NOTE 3 assumes an average og 6 measurement points, localized down to 13 microns, if required 15
NOTE 4 assumes an average og 6 measurement points, localized down to 10 microns, if required 12 
 
Maximum Aspect Ratio
Laminate thickness/hole 5 6 3
Hole placement
Hole to pattern NOTE 1  ± 0,1 mm   ± 0,08 mm  ± 0,13 mm  
Non plated holes drilled in routing program to through holes       ± 0,13 mm  
± 0,1 mm
NOTE1: Assumes maximum board dimension 300X300 mm 
Solder mask to pattern, placement accuracy and minimum bar 
Primary mask  ± 0,075 mm ± 0,050 mm ± 0,10 mm 
Plug mask NOTE1  ± 0,2 mm        
Minimum bar width  0,09 mm 0,075 mm 0,10 mm 
NOTE: If required holes with D<0,4 mm are plugged, but not completely filled. Placement is relative to hole. 
Viaplugging
Core thickness  > 0,5 mm     0,80 mm 
Screened legend (component annotation) placement accuracy and minimum features
Minimum distance to solder pad  0,2 mm       0,25 mm 
Minimum character height  1,2 mm       1,5 mm 
Minimum character stroke width  0,2 mm  0,25 mm