Product Overview

Specialists in high performance materials
Low CTE with copper-invar-copper or Thermount®
100 micron pattern technology
Resin filled blind and buried vias
Micro blind and buried vias
CAC copperfoil for excellent surface quality
Space and military product approvals

High performance constructions
Adhesiveless flex laminates
GF, GFG, GI, BI rigid materials
100 micron pattern technology
Micro blind and buried vias
Space and military product approvals

Full range of PTFE substrates
PTFE multilayer capability
Mixed dielectric hybrids
Dk of 2.1 to 10.0
Multi-gas plasma treatment
Edge plating
100 micron pattern technology
Micro blind and buried vias
Active cavities
Direct die attach
Space and military product approvals

Thermount® based constructions with low CTE internal Heat Sinks
HDI PDC's with microvias and RCC foil
Space PCB's for BGA, with soldermask and Ni/Au finish