Multilayer
GPV Printca has produced high reliability multilayer PCBs since 1977 and consequently have long experience and approved process know-how of the production of multilayer PCB's in various customised build-up´s. Our force is our know-how and our flexible production facilities, which enables us to deliver a product that is optimised to the customers application. The PCB has to comply with the characteristics necessitated by the components, the mounting process, electrical parameters, and a variety of other demanding factors, depending on the application.
Product technologies supported:
- Std. MLB with Plated Through Holes (PTH)
- Low CTE MLB
- Controlled Impedance MLB
- Sequential build MLB, with resin filled blind/buried vias
- HDI MLB with micro vias
- Mixed dielectric MLB
- MLB with integrated heat-sinks
Base materials:
| FR4: | Woven glass, impregnated with flame-retardant epoxy, is characterised by low price, flame-retardant, Tg 130°C, Epsilon depending on resin content. |
| High Tg Fr4: | Improved FR4 , with a modified epoxy resin. +10% cost acc. to FR4, flame-retardant, Tg 180°C, better resistance against multiple soldering cycles, good for high signal speed MLB. |
| Glass/polyimide: | Very high Tg 260°C, recommended for High Reliability MLB, excellent thermal stability, moisture sensitive. |
| Aramide/polyimide: | Thermount® fibre reinforcement, gives low x-y CTE 8-12ppm, low weight, excellent dimensional stability, good for HDI design. Can replace Copper-Invar-Copper in low CTE MLB. |
Copper foils from 12-70micron and quality HTE (high tensile elongation) is used. To have the best surface quality, we use CAC (a sandwich of copper-aluminium-copper) as outer layer copper foil. For fine line design, we recommend to use low treatment foils, to have the best track definition tolerance.
Copper-invar-copper is produced as a sheet or as a composit laminate.
Capability parameters:
| Max. PCB dimension | 419mm x 572mm x 4.7mm |
| Minimum dielectric | 0.05mm |
| Min. track / isolation | 100micron / 100micron |
| Min. drilled hole | 0.10mm |
| Plating ratio | 1:6, from drill 0.4mm 1:8, Micro vias 1:1 |
| Solder finish | Electroless Nickel / Immersion gold; Hot Air Solder Levelling; Reflowed tin/lead |
| Soldermask | Liquid photoimageable, dryfilm 50,70 or 100 micron, two pack epoxy Acc. to SM-840 Cl. 3, silk mat green. |
| Other masks | Peel-off mask, notation white or yellow |
| Product approvals | Mil-P-55110 (GF, GI and BI) CNES-QFT-SP 0117 (GF, GI and BI) ESA-ECSS-Q-70-11A (GF, GI and BI) |
| Lead time: | From 5 work days |