Soldermask

Wetfilm 20µ, dryfilm 50µ, 75µ or 100µ, two-pack epoxy 100µ. Openings in the soldermask should be designed acc. to insulation on outer layers. Ex: for a PCB with 6 mils insulation on outer layers, the soldermask opening should be designed as; pad size + 6 mils. Minimum soldermask-string-width; allowed between SMD is 0.2mm with open vias and 0.1mm when vias are covered with soldermask.

Via Capping with Screened Resist

Hole capping is available through the Via Cap process. On boards coated with liquid photo-imaginable mask, the vias can be screened with soldermask creating an epoxy cap.

The maximum finished hole size for via capping is 0.5mm diameter Generally, the non-test vias are capped on the bottom side of the board. Via capping on both sides results in raised or broken caps. Therefore, it is not permissible. Via caps will have a raised surface of about 50µ above the outer layer copper pad.

Peelable Soldermask

Peelable soldermask (PSM) is a temporary soldermask which is selectively applied to a circuit board. Its purpose is to protect surfaces from being soldered.

Colour: Green or blue (two different types)
Nomenclature over Solder (HAL) will have poor adherence.
Due to registration, we recommend min.
1.5mm distance/overlap with peelable mask.