Board not subjected to thermal shock (as with HAL)
Good shelf life (12 months)
Edge Connector Plating The preferred manufacturing process for gold plating of edge connectors is Tab Plating. This process does not require the extra labour and materials associated with double image plating. The maximum length of the gold plated tab is 30mm. The annular ring of a through hole must be a minimum of 2mm from the edge of the gold plated area to prevent black holes", resulting in solderability problems.
Note: The Tab Plate process is not set up for through hole plating. It is a surface plating process. But when used on top of immersion Ni/Au, it is possible to plate hard-gold in holes.
Selective Plating It is possible to plate areas separately, with extra copper. Typically it is used for selective via plating and raised SMD pads. Contact GPV for further advise.
