PCB Capabilities
Capabilities overview
SPECIFICATIONS/APPROVALS
- Perfag (industrial)
- MIL-P-55110
- MIL-P-50884
- ESA-PSS-01-710
- ESA-CNES-QFT-SP 0117
- ESA-CNES-QFT-SP 0119
- ESA-ECSS-Q-70-11-A
MATERIALS
Rigid laminate/prepreg resin systems:
- FR4, std. & improved: GF, GFG
- BT-Epoxy: GM
- Polyimide (glass reinfor.): GI
- Thermount® (aramide/polyimide): BI
Microwave materials:
RO3003, RO3006, RO3010, RO3203, RO3210, R4003, RO4350, RT6002, RT6006, RT6010LM, RT5870, RT5880, TMM3, TMM4, TMM6, TMM10 DiClad 527, D522, D870, D880, CuClad 217, C233, C250, AD300, AR320, AR350, AR450, AR600, AR1000, CLTE, 25N, 25FR
Flexible laminate systems:
• With adhesive: Butyral based, Acrylic based, Epoxy based
• Adhesiveless
All multilayer laminates are specified acc. to IPC-4101 cl II.
Copper Foils
GPV Printca A/S stocks 12, 17, 35, 70 µ copper foil, all foil is HTE type. (12 is only used with buried / blind vias). To have superior surface quality, CAC foil is used
Track Width & Insulation
| Outer layers: Minimum nominal track width: | ||
| Minimum: Price optimum: |
0.100 mm (12 µ basic Cu.) 0.125 mm (17 µ basic Cu.) | |
| Minimum nominal insulation distance: | ||
| Minimum: Price optimum: |
0.100 mm (12 µ basic Cu.) 0.125 mm (17 µ basic Cu.) | |
| Inner layers: Minimum nominal track width: | ||
| Minimum: Price optimum: |
0.100 mm (35 µ basic Cu.) 0.125 mm (35 µ basic Cu.) | |
| Minimum nominal insulation distance: | ||
| Minimum: Price optimum: |
0.100 mm (35 µ basic Cu.) 0.125 mm (35 µ basic Cu.) | |
Plated Through Holes (PTH)
Minimum mechanical drilled through std. production 0.30 mm
Minimum std. PTH diameter tolerance 0.15 mm (ex: -0.05 mm/+0.1 mm)
Micro vias, drill diameter 0.10 mm, max. depth 0.10 mm.
Annular Ring
The production tolerance, acc. to IPC-D-275 GPV Printca A/S prod. tol. for 21" panels; price optimum
| Inner Layer | Outer Layers | |
| Double sided PCBs Multilayer, drilled through holes Buried vias, two-layers Blind vias, two-layers Blind or buried vias between several layers Multilayer with flexible inner layers |
NA +0.30 mm +0.40 mm +0.40 mm +0.60 mm +0.60 mm |
+0.20 mm +0.20 mm NA +0.35 mm +0.35 mm +0.20 mm |
GPV Printca A/S prod. tol. for 18" panels
| Inner Layer | Outer Layers | |
| Double sided PCBs Multilayer, drilled through holes Buried vias, two-layers Blind vias, two-layers Blind or buried vias between several layers Multilayer with flexible inner layers |
NA +0.25 mm +0.35 mm +0.35 mm +0.55 mm +0.55 mm |
+0.17 mm +0.17 mm NA +0.32 mm +0.32 mm +0.17 mm |
Finish
Electroless Nickel/Immersion Gold (99.9% Gold)
HAL (Eutectic 63% Tin - 37% Lead)
Reflowed Tin/lead
Nickel - Hard Gold
Nickel - Soft Gold
Organic Solderability Preservative (OSP)
Chemical Tin
Solder-Mask
Wetfilm 20 µ, dryfilm 50 µ, 75 µ or 100 µ, two-pack epoxy 100 µ.
Notation, peel-off mask
Controlled Impedance
Impedance Test
Actual Impedance will be measured via the TDR (Time Domain Reflectometry) method.
Test coupon will be generated by GPV Printca A/S.
Packing Method
20 different from industrial to HiRel.
Bar-coding labels is possible.
Recommendations for pre baking of PCB's before soldering
Rigid and Rigid/Flex PCB's FR-4 and Polyimide:
PCB's up to 1.0 mm thickness: minimum 2 hours at 120° C
PCB's up to 1.8 mm thickness: minimum 4 hours at 120° C
PCB's up to 4.0 mm thickness: minimum 6 hours at 120° C
Rigid and Rigid/Flex PCB's with Polyimide/Thermount®:
All PCB thicknesses: minimum 6 hours at 135° C
Dwell time between baking and soldering is depending on the storage conditions.
At 50 % relative moisture the recommended time is max. 8 hours.
After baking the PCB's can be kept in vacuum or in an oven at 35°C, which will increase the dwell time.
Quality Assurance
UL, UL-extended, ISO 9002, AQAP 120