Technology Road Map

Revision 6, October 2006

Continuous investments in equipment, processes and knowledge make it possible to produce still more complex products. The Technology Road Map describes the main parameters for the PCB products we, today, are able to offer as standard products, these are listed as Current Capability. Planned Capability covers the future products in our production programme and the digits stated indicate the year in which we expect the product to become standard.

Current capability

Planned Capability

(xx = the last two digits in the year)

1	MATERIALS
1.1	Laminates, type	FR4	BT	Rogers 4350	HALOG. FREE	HIGH Tg FR4 High reliability	Arlon FR25
		ü	ü	ü	ü	ü	ü

1.2	Laminates, min. thickness	0.1						mm
		ü

1.3	Prepregs, min. thickness	0.06	0.05					mm
		ü	ü

2	DIMENSIONS, INNER LAYERS
2.1	Conductor width	250	200	150	100	75		mm
		ü	ü	ü	ü	ü

2.2	Conductor spacing	250	200	150	100	75		mm
		ü	ü	ü	ü	ü

2.3	Annular ring minimum, mech. drilled	420	370	320				mm
	(Pad diameter - Hole diameter)	ü	ü	06

2.4	Annular ring minimum, laser drilled	300	250	200	150			mm
	(Pad diameter - Hole diameter)	ü	ü	ü	06

3	DIMENSIONS OUTER LAYERS							Unit