Capabilities

Revision 8, October 2006

Capability specifies the standard product range which is in accordance with the PERFAG specifications and/or IPC-A-600. Our products are always in accordance with the latest revisions of these specifications.

For special requests beyond PERFAG or IPC-A-600 please contact our sales department.

PRODUCT FEATURE	Normal	Special	Cost optimum

Layers
Minimum	2	1
Maximum	20	28
Board thickness
Minimum	0.8 mm	0.1 mm	1.0 mm
Maximum	3,2 mm		1.6 mm
Inner layer laminate thickness
Minimum	0,1 mm	0.075 mm	0,2 mm
Maximum	0,93 mm	1,6 mm	0,76 mm
RCC		0,070 mm
Prepreg thickness* NOTE
Type 7628 FR4	0,18 mm		Yes
Type 2125 FR4		0,1 mm
Type 2116 FR4	0,12 mm		Yes
Type 1080 FR4	0,065 mm		Yes
Type 106 FR4		0,05 mm
NOTE: 2 prepregs as minimum between laminates unless otherwise specified N/A: Not Applicable
Copper thickness
9 micron (1/4 oz)	-	Yes
12 micron (1/3 oz)	-	Yes
17,5 micron (1/2 oz)	Yes		X
35 micron (1 oz)	Yes
50/75 micron (1,5/2 oz)	On request only
105 microns (3oz) thru 400 microns (12 oz)		On request only
PRODUCT FEATURE	Normal	Special	Cost Optimum
Minimum lines and spaces
Line/space inner layers	100 micron For Base Cu thickness £ 17,5 micron 125 microns for base copper thickness 35 microns	75 microns for base copper thicknes £ 17,5 micron	125 microns for base copper thickness £ 17,5 microns 150 microns for base copper thickness = 35 microns
Line/space Outer layers	100 micron For Base Cu thickness £ 17,5 micron 125 microns for base copper thickness = 35 microns	75 microns for base copper thicknes £ 9 micron	125 microns for base copper thickness £ 17,5 microns 150 microns for base copper thickness = 35 microns
Minimum annular ring, pad diam. – finished hole diam. (no breakout) - Mecanical drilled
Inner layers	0,42 mm	0,37 mm	0,5 mm
Outer layers	0,35 mm	0,28 mm	0,4 mm
Viaholes minimum ann.ring, pad diam. – finished hole diam.(no breakout)-Mecanical drilled
Inner layers	0,30 mm	0,25 mm
Outer layers	0,24 mm	0,20 mm
Minimum annular ring, pad diam. – finished hole diam. (no breakout) - Laser drilled
Inner layers	0,23 mm	0,15 mm	0,30 mm
Outer layers	0,20 mm	0,15 mm	0,25 mm
Minimum hole diameter after copper plating
Mech. drilled	0,15 mm	0,10 mm	0,40 mm
Laser drilled via holes	0,075 - 0,10 mm		0,10 mm
Holes, tolerance, (diameter D is nominal)
Through plated hole 0,15 £ D £ 0,5 mm 0,5 £ D £ 2,0 mm D = 2,0 thru 6,0 mm NOTE 1	+ 0,1 / -D mm ± 0,075 mm ± 0,1 mm		± 0,10 mm
Press fit connector Hole D £ 3,0 mm NOTE 2	± 0,05 mm
Non plated hole D £ 6,0 mm D > 6,0 mm	± 0,05 mm ± 0,1 mm	+ 0 / - 0.05 mm on request only
NOTE 1: ± 0,050 mm on ENIG/ISn Solder Surface NOTE 2: After copper plating
PRODUCT FEATURE	Normal	Special	Cost optimum
Hole copper plating, nominal copper thickness
Via hole minimum Aspect ratio £ 4	25 micron NOTE 1
Aspect ratio > 4	18 micron NOTE 2
Blind/buried Via Hole	15 micron NOTE 3
Laser drilled via holes	12 micron NOTE 4
NOTE 1: assumes an average of 6 measurement points, localized down to 18 microns, if required 25 NOTE 2: assumes an average of 6 measurement points, localized down to 12 microns, if required 18 NOTE 3 assumes an average og 6 measurement points, localized down to 13 microns, if required 15 NOTE 4 assumes an average og 6 measurement points, localized down to 10 microns, if required 12
Maximum Aspect Ratio
Laminate thickness/hole	8		6
Hole placement
Hole to pattern NOTE 1	± 0,1 mm	± 0,08 mm	± 0,13 mm
Non plated holes drilled in routing program to through holes	± 0,1 mm		± 0,13 mm
NOTE1: Assumes maximum board dimension 300X300 mm
Solder mask to pattern, placement accuracy and minimum bar
Primary mask	± 0,075 mm	± 0,050 mm	± 0,10 mm
Plug mask NOTE1	± 0,2 mm
Minimum bar width	0,09 mm	0,075 mm	0,10 mm
NOTE: If required holes with D<0,4 mm are plugged, but not completely filled. Placement is relative to hole.
Viaplugging
Core thickness	> 0,5 mm		0,80 mm
Screened legend (component annotation) placement accuracy and minimum features
Minimum distance to solder pad	0,2 mm		0,25 mm
Minimum character height	1,2 mm		1,5 mm
Minimum character stroke width	0,2 mm		0,25 mm
PRODUCT FEATURE	Normal	Special	Cost optimum
Screened carbon polymers for contacts
Minimum bar width	0,3 mm
Minimum spacing carbon to carbon	0,3 mm
Minimum contact area Carbon to copper	0,2 X 0,3 mm
Minimum carbon/copper overlap	0,2 mm
Minimum distance, carbon to conductor	0,5 mm
Minimum distance carbon to solder mask	0,3 mm
Minimum carbon/solder mask overlap	0,3 mm
Carbon thickness	15 - 30 micron
Maximum resistance after climatic test	200 Ohms
Surface treatment
Hot Air Leveling	1-40 microns		T 1,00 - 1,16 mm
Electroless nickel/gold (ENIG)	nickel 3,5 - 8 microns gold 0,05 - 0,2 microns
Immersion tin (ISn)	0,8 - 1,3 microns
OSP	N/A
Hard gold NOTE1	nickel 4 microns minimum gold 1,27 micron minimum	Nickel > 4 microns Gold > 1.27 microns
NOTE: Minimum distance between hard gold contacts and hole is 1,0 mm for PCB with hot air leveling and 0,7 mm for PCB with electro less nickel/gold or immersion tin
Peel able mask
Position tolerance	± 0,5 mm		0,75 mm
Minimum area	30 mm2		40 mm2
Minimum feature	3 mm		5 mm
Minimum distance to uncovered pattern	1,0 mm		1,5 mm
Maximum hole diameter for full coverage	1,5 mm		1,2 mm
Routing
Minimum tolerance	± 0,1 mm		± 0,13 mm
Minimum distance routing to pattern	Outer layers 0,2 mm Inner layers 0,4 mm		Outer layers 0.30 mm Inner layers 0.50 mm
PRODUCT FEATURE	Normal	Special	Cost optimum
Scoring
Minimum positioning tolerance	± 0,1 mm
Angle	30°
Tolerance to routing	+0,225 mm - 0,20 mm
Contour displacement relative to origin	+ 0,15 mm - 0,1 mm
PCB tolerance, 2 scored edges after separation	+ 0,2 mm - 0,1 mm
Minimum distance nom. Centerline to pattern/holes	0,5 mm		0,70 mm
Bevel/chamfer
Angles standard	<