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Capabilities

 

Revision 8, October 2006

 

Capability specifies the standard product range which is in accordance with the PERFAG specifications and/or IPC-A-600. Our products are always in accordance with the latest revisions of these specifications.

 

For special requests beyond PERFAG or IPC-A-600 please contact our sales department.

 

 

PRODUCT FEATURE
Normal
    Special   
Cost
optimum
            
Layers
Minimum
2
1
    
Maximum
20
28
    
Board thickness
Minimum
0.8 mm
0.1 mm
1.0 mm
Maximum
3,2 mm
  
1.6 mm
Inner layer laminate thickness
Minimum
0,1 mm
0.075 mm
0,2 mm
Maximum
0,93 mm
1,6 mm
0,76 mm
RCC

  

0,070 mm
    
Prepreg thickness*

NOTE
Type 7628 FR4
0,18 mm
   
Yes
Type 2125 FR4    
0,1 mm
  
Type 2116 FR4
0,12 mm
  
Yes
Type 1080 FR4
0,065 mm
   
Yes
Type 106 FR4    
0,05 mm
  
NOTE: 2 prepregs as minimum between laminates unless otherwise specified
N/A: Not Applicable
Copper thickness
9 micron (1/4 oz)
-
Yes
    
12 micron (1/3 oz)
-
Yes
    
17,5 micron  (1/2 oz)
Yes
   
X
35 micron (1 oz)
Yes
       
50/75 micron (1,5/2 oz)
On request only
       
105 microns (3oz) thru 400 microns (12 oz)  
On request only
    
PRODUCT FEATURE
Normal
Special
Cost
Optimum
Minimum lines and spaces  
Line/space inner layers
100 micron For Base Cu thickness
£ 17,5 micron
125 microns for base copper thickness 35 microns
75 microns for base copper thicknes £ 17,5 micron
125 microns for base copper thickness £ 17,5 microns
150 microns for base copper thickness = 35 microns
Line/space Outer layers
100 micron For Base Cu thickness
£ 17,5 micron
125 microns for base copper thickness = 35 microns
75 microns for base copper thicknes £ 9 micron
125 microns for base copper thickness £ 17,5 microns
150 microns for base copper thickness = 35 microns
Minimum annular ring, pad diam. – finished hole diam.  (no breakout) - Mecanical drilled
Inner layers
0,42 mm
0,37 mm
0,5 mm
Outer layers
0,35 mm
0,28 mm
0,4 mm
Viaholes minimum ann.ring, pad diam. – finished hole diam.(no breakout)-Mecanical drilled
Inner layers
0,30 mm
0,25 mm
   
Outer layers
0,24 mm
0,20 mm
   
Minimum annular ring, pad diam. – finished hole diam.  (no breakout) - Laser drilled
Inner layers
0,23 mm
0,15 mm
0,30 mm
Outer layers
0,20 mm
0,15 mm
0,25 mm
Minimum hole diameter after copper plating
Mech. drilled
0,15 mm
0,10 mm
0,40 mm
Laser drilled via holes
0,075 - 0,10 mm
   
0,10 mm
Holes, tolerance, (diameter D is nominal)
Through plated hole
0,15 £ D £ 0,5 mm
0,5 £ D £ 2,0 mm
D = 2,0 thru 6,0 mm
NOTE 1

+ 0,1 / -D mm
± 0,075 mm
± 0,1 mm
   


± 0,10 mm
Press fit connector Hole D £ 3,0 mm
NOTE 2

± 0,05 mm
   

 
Non plated hole
D £ 6,0 mm
D > 6,0 mm

± 0,05 mm
±  0,1 mm
+ 0 / - 0.05 mm
on request only

 
NOTE 1: ± 0,050 mm on ENIG/ISn Solder Surface
NOTE 2: After copper plating
PRODUCT FEATURE
Normal
Special
Cost
optimum
Hole copper plating, nominal copper thickness
Via hole minimum
Aspect ratio £ 4

25 micron
NOTE 1
  

 
Aspect ratio > 4
18 micron
NOTE 2
    
Blind/buried Via Hole
15 micron
NOTE 3
    
Laser drilled via holes
12 micron
NOTE 4
    

 

NOTE 1: assumes an average of 6 measurement points, localized down to 18 microns, if required 25
NOTE 2: assumes an average of 6 measurement points, localized down to 12 microns, if required 18
NOTE 3 assumes an average og 6 measurement points, localized down to 13 microns, if required 15
NOTE 4 assumes an average og 6 measurement points, localized down to 10 microns, if required 12

 

Maximum Aspect Ratio
Laminate thickness/hole
8
   
6
Hole placement
Hole to pattern NOTE 1
± 0,1 mm 
± 0,08 mm 
± 0,13 mm 
Non plated holes drilled in routing program to through holes

± 0,1 mm
   
± 0,13 mm 
NOTE1: Assumes maximum board dimension 300X300 mm
Solder mask to pattern, placement accuracy and minimum bar
Primary mask
± 0,075 mm
± 0,050 mm
± 0,10 mm
Plug mask NOTE1
± 0,2 mm
    
Minimum bar width
0,09 mm
0,075 mm
0,10 mm
NOTE: If required holes with D<0,4 mm are plugged, but not completely filled. Placement is relative to hole.
Viaplugging
Core thickness
> 0,5 mm
 
0,80 mm
Screened legend (component annotation) placement accuracy and minimum features
Minimum distance to solder pad
0,2 mm
   
0,25 mm
Minimum character height
1,2 mm
   
1,5 mm
Minimum character stroke width
0,2 mm
    
0,25 mm
PRODUCT FEATURE
Normal